Infrastructure
Magnetron sputtering is a versatile technique used for preparing high-quality thin films with controlled thickness, composition, and microstructure. It enables the deposition of metals, alloys, oxides, nitrides, and other functional coatings and is widely applied in materials science, surface engineering, microelectronics, and energy-related research.
The laboratory operates an ultra-high vacuum magnetron sputtering system designed for thin-film deposition on substrates up to 4 inches in diameter. The system supports DC, RF, pulsed DC, and high-power impulse magnetron sputtering (HiPIMS) modes, and allows for multi-source operation, enabling co-sputtering, reactive sputtering, and multilayer film fabrication. Motorized substrate manipulation with rotation and controlled heating ensures uniform film growth and high process reproducibility. Integrated gas dosing and in situ thickness monitoring enable precise control of deposition conditions.
Key features
- Ultra-high vacuum magnetron sputtering platform for high-purity thin-film deposition
- Multi-source configuration enabling co-sputtering and reactive sputtering processes
- DC, RF, pulsed DC, and HiPIMS operation for conductive and insulating materials
- Motorized substrate handling with rotation and controlled heating
- In situ monitoring of film thickness and deposition rate
- Computer-controlled operation with reproducible, recipe-based workflows
- EDS analysis with integrated ThermoFisher EDS detection system
- Correlation microscopy with XPS
X-ray Photoelectron Spectroscopy (XPS) is a non-destructive analytical technique used to determine the elemental composition and chemical states of material surfaces. By probing only the topmost atomic layers, XPS provides highly surface-sensitive information, enabling the accurate quantification of surface chemistry and a detailed analysis of chemical bonding environments. This makes the technique indispensable for advanced materials research and surface characterization.
Our laboratory is equipped with a Thermo Scientific Nexsa G2 XPS system, featuring a monochromated, micro-focused Al Kα X-ray source (1486.6 eV). The instrument supports ion-beam etching for depth profiling and UPS measurements. It offers an adjustable X-ray spot size ranging from 10 to 400 µm, enabling the analysis of both small, localized features and larger heterogeneous areas. The system accommodates samples up to 20 mm in thickness.
Key features
- Automated multi-technique XPS platform
Fully automated system integrating vacuum control, acquisition, and data processing for streamlined surface analysis. - Monochromated micro-focused Al Kα source
High-stability X-ray source with adjustable spot size from 10 to 400 μm for precise analysis of small or heterogeneous areas. - High-resolution hemispherical analyzer
180° analyzer providing excellent energy resolution (<0.50 eV) for reliable chemical state identification. - Integrated ion source for depth profiling
Ion gun enabling controlled sputtering and depth-resolved chemical analysis.
