The Thermo Fisher Scientific Verios 5 UC scanning electron microscope (SEM) is equipped with a Schottky field emission source and a monochromator (UC+), which enables electron energy dispersion of less than 0.2 eV and is specified to have a resolution of 0.6 nm. Sample analysis can be performed at a range of accelerating voltages from 200 V to 30 kV. The integrated in-column detection system enables simultaneous detection of topography and material contrast. Verios 5 UC allows simultaneous imaging in transmission mode using the STEM3+ detector. Chemical composition analysis can be performed using an EDX detector and Pathfinder software with optimized conditions for spectral resolution and quantitative evaluation.
- High-resolution imaging at low landing energies with the use of a monochromated beam
- Simultaneous topography (ETD, TLD) and Z-contrast (MD, ICD) imaging
- STEM imaging with the use of a segmentated STEM3+ detector
- Automated mapping of big areas with the use of MAPS SW
- EDS analysis with integrated ThermoFisher EDS detection system
- Correlation microscopy with XPS

Thermo Fisher Scientific Helios 5 CX Dual Beam is a scanning electron microscope equipped with a Ga ion beam (FIB-SEM). The electron column allows imaging with a resolution of up to 0.6 nm. Sample imaging can be performed at a range of accelerating voltages from 200 V to 30 kV. An integrated in-column detection system allows simultaneous detection of topography and material contrast. Helios 5 CX enables simultaneous imaging in transmission mode using the STEM3+ detector.
Modification of samples with the use of a Tomahawk™ ion column enables the high-precision preparation of lamellas for analysis in a transmission electron microscope and high-volume milling for the analysis of large areas. Chemical composition and crystallography analysis can be performed using a combination of EDS and EBSD detectors, along with Aztec software, under optimized conditions for spectral resolution and quantitative evaluation.
- High resolution imaging at low landing energies
- Simultaneous topography (ETD, TLD) and Z-contrast (MD, ICD) imaging
- STEM imaging with the use of a segmentated STEM3+ detector
- Automated mapping with the use of MAPS SW
- Semi-automated lamella preparation with the use of AutoTEM SW
- Automated 3D analysis with the use of Auto Slice & View SW
- Versatile Ion processing of materials with the use of Tomahawk™ HT Ga ion column
- Simultaneous EDS and EBSD analysis with integrated detectors from Oxford Instruments
